Comprehensive R&D team

Our powerful R&D team gathers talents engaged in material research, new product development, and manufacturing process design and optimization. They keep improving processing technologies for multilayer, HDI, metal-based, flexible, rigid-flex, high-frequency, special, and other PCBs, improving the technology level dramatically, and leading technological innovation and product upgrading.

Participation in standard formulation

We participate actively in the formulation of industry, national and international standards, including 15 industry standards, such as the Sectional Design Standard for Flexible Printed Boards (IPC2223), and the Qualification and Performance Specification for High Frequency (Microwave) Printed Boards (IPC6018).

Technology achievement transformation

We have received 603 licensed patents in total, including 301 invention patents and 302 utility model patents, and published over 200 papers in domestic core journals. 7 technologies, including the key technology of buried magnetic core PCB for micro-power chip power supplies, have been rated as globally advanced technologies, and 34 technologies, including the key technology of high-speed PCB for low-orbit satellite communication, have been rated as domestically leading/advanced technologies. We have received scientific and technological awards from provincial, municipal, and district governments many times.

ISO certified laboratory

As of 2024, the Central Laboratory had invested 85 million yuan to introduce over 180 sets of advanced testing equipment. It is able to test over 100 items, and is leading in the industry in terms of scale and equipment value. It was certified by CNAS to comply with ISO/IEC 17025:2005 “General requirements for the Competence of Testing and Calibration Laboratories” in January 2017. We can issue credible test reports for reference, and our independent laboratory can shorten lead times greatly, ensure quality, and make us more competitive in the market.