HDI PCB

HDI, High Density Interconnect, with microvia≤0.15mm， use fine feature technology to connect components in small packages. HDI’s smaller geometry allows for higher wiring density. The electrical performance is greatly improved because of control on lower parasitic, minimal stubs, removal of decoupling capacitors and lower crosstalk. RFI and EMI is much lower due to ground planes being closer together, distributed capacitance is closer.