
Kinwong multilayer PCB manufacturing method was selected as the 23rd China Patent Excellence Award
On April 15, 2022, the China Intellectual Property Office announced the evaluation results of the 23rd China Patent Award. Kinwong’s multi-layer PCB production method and multi-layer PCB board won the China Patent Excellence Award. The China Patent Award is co-sponsored by the China Intellectual Property Office and the World Intellectual Property Organization. It is a government department award at the national level that rewards inventions and creations with patent rights. It is an authoritative award