Kinwong News

On April 15, 2022, the China Intellectual Property Office announced the evaluation results of the 23rd China Patent Award. Kinwong’s multi-layer PCB production method and multi-layer PCB board won the China Patent Excellence Award. The China Patent Award is co-sponsored by the China Intellectual Property Office and the World Intellectual Property Organization. It is a government department award at the national level that rewards inventions and creations with patent rights. It is an authoritative award

Interposer packaging, as the current mainstream advanced packaging technology, mainly focuses on three aspects: light, thin and compact, high-speed signal, density and pitch reduction. It puts forward extremely strict requirements for PCB wiring density, signal integrity, and reliability. Kinwong Zhuhai SLP factory has developed 9-N-9 HDI Interposer products with end customers, which are applied to high-performance CPUs, including buried and blind via designs and use low loss & ultra low loss high speed materials for

From January 19-21, 2022, NEPCON Japan 2022 was successfully held in Tokyo Big Sight, Japan. As Asia’s leading electronics tech. show, the exhibition also includes Internepcon Japan, IC & Sensor Packaging Technology Expo, Printed Wiring Boards Expo, Electrotest Japan, Electronic Components & Materials Expo, Fine Process Technology Expo. With high industry visibility and comprehensive product display, Kinwong electronics won attention and appreciation of many audiences. Kinwong is a leading electronic circuit manufacturer in the world,