With the booming of AI, AI PCB technology is iterating at a faster pace, reshaping the landscape of the PCB industry. As a major global AI server PCB manufacturer, Kinwong has gained rich production control experience in high-speed and high-reliability AI server PCBs. Currently, the Zhuhai HLC Factory has a production capacity of through-hole and 3+HDI PCBs of 100,000 km2, and advanced HDI SLPs of 60,000 km2, and can meet the demand of intelligent computing centers for high-reliability PCBs, including optical modules, BBUs, OAMs, CPU motherboards, switch boards, etc. In terms of high-end process capabilities, the Zhuhai Factory is able to mass produce N+N structure PCBs of over 40 layers, HLC PCBs of over 70 layers, 9-order 28-layer HDI PCBs, 12-layer Anylayer rigid-flex PCBs, and high-speed FPC products. It has also established an elite service team in the industry, and kept launching better process capabilities and a more sophisticated high-speed material library by following requirements of mainstream server chip platforms closely to comply with material selection specifications of different customers.
Key technologies applied by Kinwong to server PCBs:
Ultra-HLC technology
Advanced HDI / Anylayer technology
Staircase gold finger process
HLC alignment accuracy
Skip-Via technology
POFV technology
Small-hole back drilling technology
Local thick copper heat dissipation process
Excellent impedance control capability
Good signal integrity (SI)
Graded and segmented gold finger technology
Complete high-speed PCB material library
Ultra-high thickness-to-diameter ratio process capability
Application of reversed copper foils and ultra-low loss materials