SLPs

Electronic products such as smartphones, tablets and wearable devices are becoming increasingly intelligent, thin and versatile. Kinwong has invested in and established the Zhuhai SLP and IC packaging substrate factories in active response to this technology trend, achieving technological breakthroughs such as more stacking layers, smaller line widths and spacing, and the carrying of functional modules.

The Zhuhai SLP Factory mainly produces Anylayer, SLPs, and IC package substrates with up to 18 layers, which are applied to fields such as AI servers, optical modules, HPC, consumer electronics (e.g., mobile phones, wearables, tablets, cameras, notebooks), IoT, industrial control, and automotive electronics.

Product positioning:

AI servers, mobile phones, advanced consumer HDI PCBs, IC package substrates, automotive HDI PCBs, ≥800G communication optical module PCBs, HPC, and SLPs.