Kinwong Electronic Show Up At 2024 NEPCON JAPAN

From January 24 to 26, 2024, the 38th Japan International Electronics Manufacturing and Microelectronics Industry Exhibition “NEPCON JAPAN 2024” was held at the Tokyo International Convention and Exhibition Center, Tokyo, Japan.   Kinwong, the world’s leading manufacturer of electronic circuits, was invited to show some representative products and new technology research and development achievements of the printed circuit board business, Kinwong showcased many advantageous products such as copper inserts, high-density interconnected HDI, multi-layer flexible boards, rigid-flex boards, thick copper plates, high-precision rigid-flex boards, high-layer high-speed substrates, ceramic substrates, etc.   The application fields of the products cover the whole field of electronic products such as on-board millimeter-wave radar, on-board ADCU, 5G base station, low-orbit satellite, server, switching router, smart phone, module power supply, display module, new energy battery, smart home and so on.   Many customers visited the booth and expressed their appreciation for Kinwong’s diversified product selection and one-stop service, as well as Kinwong’s deep technical background in the field of high-density interconnection, high-speed multi-layer, high-frequency, high-heat dissipation, multi-layer flexible board and rigid-flex board.