Smart Terminal

Intelligent terminal products are becoming thinner, lighter, smaller and more integrated. The IoT brings us new user experiences, and biometric technology and AI are also becoming an indispensable part of such devices. PCB technology has developed from through holes to local buried holes, outer blind holes, and non-mechanical hole forming technology, with increasingly smaller circuits and more layers.

HDI PCBs have advantages such as high wiring density and flexible winding. By using fine lines to connect components in extremely small packages, they are important components that provide device connections to mobile terminals. FPCs have advantages such as light weight, small thickness, bendability, and high flexibility, and can withstand millions of dynamic bends without wire damage, making it possible to provide functional electrical connections in extremely small spaces. They can move freely or fold within limited spacing to obtain 3D components.