Kinwong Anylayer technology has made a major breakthrough!

Anylayer (any layer interconnection), as an important symbol of high-end PCB manufacturing, is widely used in flagship smartphones, new consumer electronics and other fields. In order to increase the share of high value-added products and meet the requirements of customers, Zhuhai Kinwong SLP and IC packaging factory carried out technical research, and achieved a major breakthrough in the 14-layer Anylayer project.

For the 14-layer Anylayer project, the Kinwong R&D team overcame a number of technical difficulties, such as the interlayer alignment of 6 times of material lamination, the reliability guarantee after multiple reflows, and the expansion and shrinkage control after multiple laminations,  finally, we realized the product delivery and recognized by major AR/VR manufacturers.