![KINWONG 9-N-9 HDI Interposer project achieves new breakthrough](https://www.kinwong.com/wp-content/uploads/2022/02/KINWONG-9-N-9-HDI-Interposer-project-achieves-new-breakthrough-300x128.png)
Kinwong 9-N-9 HDI Interposer project achieves new breakthrough
Interposer packaging, as the current mainstream advanced packaging technology, mainly focuses on three aspects: light, thin and compact, high-speed signal, density and pitch reduction. It puts forward extremely strict requirements for PCB wiring density, signal integrity, and reliability. Kinwong Zhuhai SLP factory has developed 9-N-9 HDI Interposer products with end customers, which are applied to high-performance CPUs, including buried and blind via designs and use low loss & ultra low loss high speed materials for