Kinwong News

Interposer packaging, as the current mainstream advanced packaging technology, mainly focuses on three aspects: light, thin and compact, high-speed signal, density and pitch reduction. It puts forward extremely strict requirements for PCB wiring density, signal integrity, and reliability. Kinwong Zhuhai SLP factory has developed 9-N-9 HDI Interposer products with end customers, which are applied to high-performance CPUs, including buried and blind via designs and use low loss & ultra low loss high speed materials for

Shenzhen Kinwong Electronic Co., Ltd. (multilayer boards, flexible boards) and Kinwong Electronic Technology (Longchuan) Co., Ltd. (multilayer boards, flexible boards, metal-based circuit boards) enter the third batch of lists that meet the “standard conditions for the printed circuit industry” issued by the Ministry of Industry and Information Technology of the People’s Republic of China. The Ministry of Industry and Information Technology has formulated the “Regulations for the Printed Circuit Board Industry”, which aims to promote

From January 19-21, 2022, NEPCON Japan 2022 was successfully held in Tokyo Big Sight, Japan. As Asia’s leading electronics tech. show, the exhibition also includes Internepcon Japan, IC & Sensor Packaging Technology Expo, Printed Wiring Boards Expo, Electrotest Japan, Electronic Components & Materials Expo, Fine Process Technology Expo. With high industry visibility and comprehensive product display, Kinwong electronics won attention and appreciation of many audiences. Kinwong is a leading electronic circuit manufacturer in the world,

  At present, folding screen mobile phones are developing rapidly. The connection between dual screens relies on flexible FPC, and the number of cameras increases, which increases the amount of FPC and puts forward higher requirements on the number of times the FPC can be bent. Kinwong FPC technology research and development department participates in customer simulation design and product development certification, operates in IPD mode, conducts research from simulation, wiring and other aspects, optimizes

Anylayer (any layer interconnection), as an important symbol of high-end PCB manufacturing, is widely used in flagship smartphones, new consumer electronics and other fields. In order to increase the share of high value-added products and meet the requirements of customers, Zhuhai Kinwong SLP and IC packaging factory carried out technical research, and achieved a major breakthrough in the 14-layer Anylayer project. For the 14-layer Anylayer project, the Kinwong R&D team overcame a number of technical

In January 2022, Kinwong won the Foxconn Quality Supplier Award, Roborock Best Quality Award and Wistron Best Supplier Award for Kinwong’s excellent quality, timely delivery and continuously growing technical capability and service level.